Automated Optical Inspection (AOI 500)
Advanced Optical Inspection System for Semiconductor Wafers
- Ultra-Fine Defect Detection (as small as 0.5μm)
- Non-Periodic Scan Technology (HyVISION Only)
- Real-Time Processing Architecture
(Distributed/Multi-Processing, Multi-Threading) - High-Resolution Telecentric Illumination
High-Performance LED Lighting
- AI Deep Learing Algorithms
(Wafer Teaching/Defect Detection/Defect Classification)
Key Features Technical
Built on our core capabilities and differentiated technologies,
we present the key features and technical strengths that deliver new value to our customers.
* Click a marker to explore each zone.
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Mono Camera
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- Mono Camera
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BF Light
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- BF Light
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Tube Lens
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- Tube Lens
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Noise Piece
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- Noise Piece
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DF Light
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- DF Light
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Color Camera
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- Color Camera
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Porous Chuck
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- Porous Chuck
Main Features
Ultra-Fine Defect Detection
Provides high-resolution inspection technology that
precisely detects ultra-fine defects and external
foreign matter at the 0.5um level.
Non-Periodic Scan Technology (HyVISION Only)
Supports both periodic and non-periodic scan methods
to flexibly respond to various inspection conditions,
enabling inspection of fixed patterns as well as irregular
environments.
Automated Wafer Vision Teaching
Automates Wafer / Vision Teaching to reduce
operator dependency and shorten setup time.
Real-Time Processing Architecture
Real-time inspection system based on distributed
/ multi-processing / multi-thread architecture.
High-Resolution Telecentric Illumination
Applies telecentric illumination to secure uniform
light distribution and distortion-free high-resolution
images, providing a precise inspection environment.
High-Performance LED Lighting
Applies LEDs with +/-2% brightness deviation and up to
20,000 hours lifetime to improve image quality consistency
and maintenance efficiency, implementing an optimized
inspection environment through in-house light source technology.
AI-Based Defect Detection & Classification
Combines rule-based algorithms with AI deep
learning to improve inspection accuracy and scalability.
Application
Wafer Surface Defect Inspection
Detecting fine defects on the wafer surface
Wafer Surface Defect InspectionDetecting fine defects on the wafer surface
Display Inspection
Surface defects inspected by focusing on the display surface
Display InspectionSurface defects inspected by focusing on the display surface
Cover Glass Inspection
Surface defects inspected by focusing on the cover glass surface
Cover Glass InspectionSurface defects inspected by focusing on the cover glass surface